JP5006340B2

5G

Title

Not Available

Application Number:

JP20080550499

Publication Date:

22-08-2012

Current Assignee:

Family ID:

Application Date:

10-01-2007

Declaring Company:

Publication Country:

US

Priority Date:

11-01-2006

Title

Not Available

Application Number:

JP20080550499

Family ID:

Publication Country:

US

Publication Date:

22-08-2012

Application Date:

10-01-2007

Priority Date:

11-01-2006

Current Assignee:

Declaring Company:

Abstract  Abstract

PURPOSE: Kannai-plane temperature distribution in the wafer in the furnace core measured temperature measurement device 10 in wherein the wafer has a same planar shape and a jig having the same heat capacity 11 inside the plurality of thermocouples 12 is embedded in the temperature measurement device. EFFECT: In-plane temperature distribution of the wafer and a thermocouple for measuring 12 furnace core tube and the wafer can be carried in the said well the thermocouple 12 is embedded in a jig 11 of the temperature distribution of the wafer and by indicating a change in the same manner but also the heat treatment the wafer is carried into the furnace core tube wherein the wafer even when the thermal history can be accurately monitored a deposit prediction and control of defects or the like can be accurately performed.

Note:

The information in blue was extracted from the third parties (Standard Setting Organisation, Espacenet)

The information in grey was provided by the patent holder

The information in purple was extracted from the FrandAvenue

Explicitly disclosed patent:openly and comprehensibly describes all details of the invention in the patent document.

Implicitly disclosed patent:does not explicitly state certain aspects of the invention, but still allows for these to be inferred from the information provided.

Basis patent:The core patent in a family, outlining the fundamental invention from which related patents or applications originate.

Family member:related patents or applications that share a common priority or original filing.